Ten Years of Rowhammer
Retrospective survey of Rowhammer variants and mitigations, from the original 2014 disclosure through modern TRR bypasses and field measurement. This is the talk the entity treats as a market report.
/papers/silicon/ccc-media/
Rowhammer at 38C3
Two talks the entity files together: one about ten years of Rowhammer bypasses, one about what through-package silicon inspection can and cannot see. In the story they form the confidence interval: software can still flip rows, and cheap inspection still cannot see dopant wells.
IRIS: Non-Destructive Inspection of Silicon
The defensive counterpart: through-package imaging can expose metal layers and layout tampering, but it is not a magic answer to active-region dopant changes. The entity files this beside Becker.
If a video frame refuses embedding, use the media.ccc.de link. The local window is still the reading desk: notes, source links, and the relevant story context stay in one place.